Copper-Covered Ceramic Substrate Polishing Slurry

Copper is a good conductor. Resin substrates, metal substrates and ceramic substrates all need to be coated with copper to be used in electrical appliances. Ceramic substrate itself has good high temperature and corrosion resistance characteristics, after copper covered will be widely used in some high power electrical appliances and some high-end electrical appliances. The ceramic substrate coated with copper also needs to be polished to create a good surface.

Our Copper-Covered Ceramic Substrate Polishing Slurry  provides a mirror-like surface finish with no compromise on removal rate.

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE FEATURES

Copper-Covered Ceramic Substrate Polishing Slurry is developed for Copper-Covered Ceramic Substrate such as Copper-Clad ceramic substrate and Copper-Coated ceramic substrate.

According to the characteristics of copper material and high requirements of the PCB fabricate, it is a challenge to obtain mirror-like surface finish with no compromise on polishing rate.

Kona nano alumina water-based polishing slurry for Copper-Covered Ceramic Substrate provides a good surface finish with no compromise on polishing rate.

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE ADVANTAGES

Alumina Polishing Slurry for Copper-Covered Ceramic Substrate Advantages

Kona offers a range of polishing slurry for Ceramic & Copper-Covered Ceramic Substrates.

Copper is a soft metal (Mohs hardness 3) , and it is a highly reactive metal and it oxidizes very easily. That increases the difficulty of polishing Copper-Covered Ceramic Substrate.

Our Copper-Covered Ceramic Substrate Polishing Slurry designed for Copper-Covered Ceramic Substrate polishing process, it is a water-based nano alumina polishing suspension  slurry added a additive special for the characteristic of copper.

Our Copper-Covered Ceramic Substrate Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate.